dc.contributor.author | Fang, Yu | |
dc.contributor.author | Ciofi, Ivan | |
dc.contributor.author | Roussel, Philippe | |
dc.contributor.author | Lesniewska, Alicja | |
dc.contributor.author | Degraeve, Robin | |
dc.contributor.author | De Wolf, Ingrid | |
dc.contributor.author | Croes, Kristof | |
dc.date.accessioned | 2023-11-27T07:55:33Z | |
dc.date.available | 2023-08-02T17:18:14Z | |
dc.date.available | 2023-11-27T07:55:33Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 0018-9383 | |
dc.identifier.other | WOS:001030682500001 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42253.3 | |
dc.source | WOS | |
dc.title | Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch Interconnects | |
dc.type | Journal article | |
dc.contributor.imecauthor | Fang, Yu | |
dc.contributor.imecauthor | Ciofi, Ivan | |
dc.contributor.imecauthor | Roussel, Philippe | |
dc.contributor.imecauthor | Lesniewska, Alicja | |
dc.contributor.imecauthor | Degraeve, Robin | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.imecauthor | Croes, Kristof | |
dc.contributor.orcidimec | Fang, Yu::0000-0002-9442-524X | |
dc.contributor.orcidimec | Ciofi, Ivan::0000-0003-1374-4116 | |
dc.contributor.orcidimec | Roussel, Philippe::0000-0002-0402-8225 | |
dc.contributor.orcidimec | Lesniewska, Alicja::0000-0003-3863-065X | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
dc.identifier.doi | 10.1109/TED.2023.3287168 | |
dc.source.numberofpages | 6 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 4332 | |
dc.source.endpage | 4337 | |
dc.source.journal | IEEE TRANSACTIONS ON ELECTRON DEVICES | |
dc.source.issue | 18 | |
dc.source.volume | 70 | |
imec.availability | Published - imec | |