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Intermetallic Compounds as Alternatives to Copper for Advanced Interconnect Metallization

dc.contributor.authorAdelmann, Christoph
dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorScheerder, Jeroen
dc.contributor.authorFleischmann, Claudia
dc.contributor.authorSankaran, Kiroubanand
dc.contributor.authorPourtois, Geoffrey
dc.contributor.authorSwerts, Johan
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2024-05-27T12:50:44Z
dc.date.available2023-08-07T17:07:25Z
dc.date.available2024-05-27T12:50:44Z
dc.date.issued2023
dc.identifier.issn2380-632X
dc.identifier.otherWOS:001027381700040
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42291.3
dc.sourceWOS
dc.titleIntermetallic Compounds as Alternatives to Copper for Advanced Interconnect Metallization
dc.typeProceedings paper
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.imecauthorSoulie, Jean-Philippe
dc.contributor.imecauthorFleischmann, Claudia
dc.contributor.imecauthorSankaran, Kiroubanand
dc.contributor.imecauthorPourtois, Geoffrey
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorScheerder, Jeroen
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecFleischmann, Claudia::0000-0003-1531-6916
dc.contributor.orcidimecSankaran, Kiroubanand::0000-0001-6988-7269
dc.contributor.orcidimecPourtois, Geoffrey::0000-0003-2597-8534
dc.contributor.orcidimecSwerts, Johan::0000-0001-7547-7194
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.contributor.orcidimecScheerder, Jeroen::0000-0002-9301-0392
dc.identifier.doi10.1109/IITC/MAM57687.2023.10154839
dc.identifier.eisbn979-8-3503-1097-9
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM)
dc.source.conferencedateMAY 22-25, 2023
dc.source.conferencelocationDresden
dc.source.journalN/A
imec.availabilityPublished - imec
dc.description.wosFundingTextThis work has been supported by imec's industrial affiliate program on nano-interconnects.


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320.500.12860/42291.3*2024-05-27T12:49:13Zvalidation by library/open access desk
120.500.12860/422912023-08-07T17:07:25Z

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