dc.contributor.author | Founta, Valeria | |
dc.contributor.author | Soulie, Jean-Philippe | |
dc.contributor.author | De Wolf, Ingrid | |
dc.contributor.author | de Vondel, Joris Van | |
dc.contributor.author | Swerts, Johan | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Adelmann, Christoph | |
dc.date.accessioned | 2023-12-18T11:51:27Z | |
dc.date.available | 2023-09-03T17:38:58Z | |
dc.date.available | 2023-12-18T11:51:27Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | na | |
dc.identifier.other | WOS:001004185500092 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42456.2 | |
dc.source | WOS | |
dc.title | Ru Stress Assessment by Membrane Wrinkling for Interconnect Applications | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Founta, Valeria | |
dc.contributor.imecauthor | Soulie, Jean-Philippe | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.imecauthor | Swerts, Johan | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Adelmann, Christoph | |
dc.contributor.orcidimec | Soulie, Jean-Philippe::0000-0002-5956-6485 | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.contributor.orcidimec | Adelmann, Christoph::0000-0002-4831-3159 | |
dc.contributor.orcidimec | Swerts, Johan::0000-0001-7547-7194 | |
dc.contributor.orcidimec | Tokei, Zsolt::0000-0003-3545-3424 | |
dc.identifier.doi | 10.1109/EDTM55494.2023.10103023 | |
dc.identifier.eisbn | 979-8-3503-3252-0 | |
dc.source.numberofpages | 3 | |
dc.source.peerreview | yes | |
dc.source.conference | 7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM) | |
dc.source.conferencedate | MAR 07-10, 2023 | |
dc.source.conferencelocation | Seoul | |
dc.source.journal | na | |
imec.availability | Published - imec | |
dc.description.wosFundingText | This work was supported by imec's industrial affiliate program on nano-interconnects and the department of Physics and Astronomy at KUL. The authors gratefully acknowledge the contributions of imec's MCA lab for the TEM images. V.F. acknowledges the support of a PhD scholarship from the Fonds Wetenschappelijk Onderzoek - Vlaanderen (FWO). | |