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dc.contributor.authorTyaginov, Stanislav
dc.contributor.authorBury, Erik
dc.contributor.authorGrill, Alexander
dc.contributor.authorYu, Z.
dc.contributor.authorMakarov, Alexander
dc.contributor.authorDe Keersgieter, An
dc.contributor.authorVexler, M. I.
dc.contributor.authorVandemaele, Michiel
dc.contributor.authorWang, R.
dc.contributor.authorSpessot, Alessio
dc.contributor.authorVaisman Chasin, Adrian
dc.contributor.authorKaczer, Ben
dc.date.accessioned2024-05-23T14:46:49Z
dc.date.available2023-09-03T17:38:59Z
dc.date.available2024-05-23T14:46:49Z
dc.date.issued2023
dc.identifier.issnN/A
dc.identifier.otherWOS:001004185500179
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42459.2
dc.sourceWOS
dc.titleOn the Contribution of Secondary Holes in Hot-Carrier Degradation a Compact Physics Modeling Perspective
dc.typeProceedings paper
dc.contributor.imecauthorYu, Z.
dc.contributor.imecauthorTyaginov, Stanislav
dc.contributor.imecauthorBury, Erik
dc.contributor.imecauthorGrill, Alexander
dc.contributor.imecauthorMakarov, Alexander
dc.contributor.imecauthorDe Keersgieter, An
dc.contributor.imecauthorVandemaele, Michiel
dc.contributor.imecauthorSpessot, Alessio
dc.contributor.imecauthorVaisman Chasin, Adrian
dc.contributor.imecauthorKaczer, Ben
dc.contributor.orcidimecTyaginov, Stanislav::0000-0002-5348-2096
dc.contributor.orcidimecBury, Erik::0000-0002-5847-3949
dc.contributor.orcidimecGrill, Alexander::0000-0003-1615-1033
dc.contributor.orcidimecMakarov, Alexander::0000-0002-9927-6511
dc.contributor.orcidimecDe Keersgieter, An::0000-0002-5527-8582
dc.contributor.orcidimecVandemaele, Michiel::0000-0003-0740-4115
dc.contributor.orcidimecSpessot, Alessio::0000-0003-2381-0121
dc.contributor.orcidimecVaisman Chasin, Adrian::0000-0002-9940-0260
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.identifier.doi10.1109/EDTM55494.2023.10103111
dc.identifier.eisbn979-8-3503-3252-0
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.conference7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM)
dc.source.conferencedateMAR 07-10, 2023
dc.source.conferencelocationSeoul
dc.source.journalN/A
imec.availabilityPublished - imec
dc.description.wosFundingTextthis work was partially supported by the Ministry of Science and Higher Education of the Russian Federation under Grant number 075-15-2020-790.


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