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dc.contributor.authorWagih, Mahmoud
dc.contributor.authorBalocchi, Leonardo
dc.contributor.authorBenassi, Francesca
dc.contributor.authorCarvalho, Nuno B.
dc.contributor.authorChiao, Jung-Chih
dc.contributor.authorCorreia, Ricardo
dc.contributor.authorCostanzo, Alessandra
dc.contributor.authorCui, Yepu
dc.contributor.authorGeorgiadou, Dimitra
dc.contributor.authorGouveia, Carolina
dc.contributor.authorGrosinger, Jasmin
dc.contributor.authorHo, John S.
dc.contributor.authorHu, Kexin
dc.contributor.authorKomolafe, Abiodun
dc.contributor.authorLemey, Sam
dc.contributor.authorLoss, Caroline
dc.contributor.authorMarrocco, Gaetano
dc.contributor.authorMitcheson, Paul
dc.contributor.authorPalazzi, Valentina
dc.contributor.authorPanunzio, Nicoletta
dc.contributor.authorPaolini, Giacomo
dc.contributor.authorPinho, Pedro
dc.contributor.authorPreishueber-Pflugl, Josef
dc.contributor.authorQaragoez, Yasser
dc.contributor.authorRahmani, Hamed
dc.contributor.authorRogier, Hendrik
dc.contributor.authorLopera, Jose Romero
dc.contributor.authorRoselli, Luca
dc.contributor.authorSchreurs, Dominique
dc.contributor.authorTentzeris, Manos
dc.contributor.authorTian, Xi
dc.contributor.authorTorah, Russel
dc.contributor.authorTorres, Ricardo
dc.contributor.authorVan Torre, Patrick
dc.contributor.authorVital, Dieff
dc.contributor.authorBeeby, Steve
dc.date.accessioned2023-11-06T09:00:44Z
dc.date.available2023-10-23T10:15:04Z
dc.date.available2023-11-06T09:00:44Z
dc.date.issued2023
dc.identifier.issn2692-8388
dc.identifier.otherWOS:001068636000015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42906.2
dc.sourceWOS
dc.titleMicrowave-Enabled Wearables: Underpinning Technologies, Integration Platforms, and Next-Generation Roadmap
dc.typeJournal article
dc.contributor.imecauthorLemey, Sam
dc.contributor.imecauthorRogier, Hendrik
dc.contributor.imecauthorVan Torre, Patrick
dc.contributor.orcidimecLemey, Sam::0000-0003-1366-2604
dc.contributor.orcidimecRogier, Hendrik::0000-0001-8139-2736
dc.contributor.orcidimecVan Torre, Patrick::0000-0002-0633-0815
dc.date.embargo2023-01-06
dc.identifier.doi10.1109/JMW.2022.3223254
dc.source.numberofpages34
dc.source.peerreviewyes
dc.source.beginpage193
dc.source.endpage226
dc.source.journalIEEE JOURNAL OF MICROWAVES
dc.source.issue1
dc.source.volume3
imec.availabilityPublished - open access
dc.description.wosFundingTextThis work was supported in part by the U.K. Royal Academy of Engineering (RAEng) and the Office of the Chief Science Adviser for National Security through the U.K. Intelligence Community Research Fellowship Programme, in part by the RAEng chairs in emerging technologies scheme, in part by the U.K. Engineering and Physical Sciences Research Council, under Grant EP/P010164/1, and in part by UKRI under Grant MR/V024442/1.


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