dc.contributor.author | Saleh, Ahmed | |
dc.contributor.author | Croes, Kristof | |
dc.contributor.author | Ceric, H. | |
dc.contributor.author | De Wolf, Ingrid | |
dc.contributor.author | Zahedmanesh, Houman | |
dc.date.accessioned | 2023-11-28T09:17:10Z | |
dc.date.available | 2023-11-12T17:45:37Z | |
dc.date.available | 2023-11-28T09:17:10Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 0021-8979 | |
dc.identifier.other | WOS:001089501700006 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43138.2 | |
dc.source | WOS | |
dc.title | A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability | |
dc.type | Journal article | |
dc.contributor.imecauthor | Saleh, Ahmed | |
dc.contributor.imecauthor | Croes, Kristof | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.imecauthor | Zahedmanesh, Houman | |
dc.contributor.orcidimec | Saleh, Ahmed::0000-0002-2663-1922 | |
dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.contributor.orcidimec | Zahedmanesh, Houman::0000-0002-0290-691X | |
dc.identifier.doi | 10.1063/5.0165949 | |
dc.source.numberofpages | 12 | |
dc.source.peerreview | yes | |
dc.source.beginpage | Art. 135102 | |
dc.source.endpage | na | |
dc.source.journal | JOURNAL OF APPLIED PHYSICS | |
dc.source.issue | 13 | |
dc.source.volume | 134 | |
imec.availability | Published - imec | |