dc.contributor.author | Lin, Shih-Hsiang | |
dc.contributor.author | Simicic, Marko | |
dc.contributor.author | Pantano, Nicolas | |
dc.contributor.author | Chen, Shih-Hung | |
dc.contributor.author | Roussel, Philippe | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Wambacq, Piet | |
dc.date.accessioned | 2024-03-21T14:01:05Z | |
dc.date.available | 2023-11-30T16:47:44Z | |
dc.date.available | 2024-03-21T14:01:05Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 0739-5159 | |
dc.identifier.other | WOS:001094864400018 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43201.2 | |
dc.source | WOS | |
dc.title | ESD mitigation for 3D IC hybrid bonding | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Lin, Shih-Hsiang | |
dc.contributor.imecauthor | Simicic, Marko | |
dc.contributor.imecauthor | Pantano, Nicolas | |
dc.contributor.imecauthor | Chen, Shih-Hung | |
dc.contributor.imecauthor | Roussel, Philippe | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Wambacq, Piet | |
dc.contributor.orcidimec | Simicic, Marko::0000-0002-3623-1842 | |
dc.contributor.orcidimec | Pantano, Nicolas::0000-0002-8803-8374 | |
dc.contributor.orcidimec | Chen, Shih-Hung::0000-0002-6481-2951 | |
dc.contributor.orcidimec | Roussel, Philippe::0000-0002-0402-8225 | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Wambacq, Piet::0000-0003-4388-7257 | |
dc.identifier.eisbn | 978-1-58537-347-5 | |
dc.source.numberofpages | 9 | |
dc.source.peerreview | yes | |
dc.source.conference | 45th Annual Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium | |
dc.source.conferencedate | OCT 02-04, 2023 | |
dc.source.conferencelocation | Riverside | |
dc.source.journal | N/A | |
imec.availability | Published - imec | |