dc.contributor.author | Duflou, Rutger | |
dc.contributor.author | Houssa, Michel | |
dc.contributor.author | Afzalian, Aryan | |
dc.date.accessioned | 2024-03-06T09:56:31Z | |
dc.date.available | 2024-01-11T17:16:19Z | |
dc.date.available | 2024-03-06T09:56:31Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 1946-1569 | |
dc.identifier.other | WOS:001117703800045 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43387.2 | |
dc.source | WOS | |
dc.title | Ballistic heat transport in MoS<sub>2</sub> monolayers | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Duflou, Rutger | |
dc.contributor.imecauthor | Houssa, Michel | |
dc.contributor.imecauthor | Afzalian, Aryan | |
dc.contributor.orcidimec | Duflou, Rutger::0000-0002-0357-1293 | |
dc.contributor.orcidimec | Houssa, Michel::0000-0003-1844-3515 | |
dc.contributor.orcidimec | Afzalian, Aryan::0000-0002-5260-0281 | |
dc.identifier.eisbn | 978-4-86348-803-8 | |
dc.source.numberofpages | 4 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 177 | |
dc.source.endpage | 180 | |
dc.source.conference | International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) | |
dc.source.conferencedate | SEP 27-29, 2023 | |
dc.source.conferencelocation | Kobe | |
dc.source.journal | N/A | |
imec.availability | Published - imec | |