dc.contributor.author | Wei, Chih-, I | |
dc.contributor.author | Kang, Seulki | |
dc.contributor.author | Das, Sayantan | |
dc.contributor.author | Oya, Masahiro | |
dc.contributor.author | Okamoto, Yosuke | |
dc.contributor.author | Maruyama, Kotaro | |
dc.contributor.author | Fenger, Germain | |
dc.contributor.author | Latypov, Azat | |
dc.contributor.author | Kusnadi, Ir | |
dc.contributor.author | Khaira, Gurdaman | |
dc.contributor.author | Yamazaki, Yuichiro | |
dc.contributor.author | Gillijns, Werner | |
dc.contributor.author | Halder, Sandip | |
dc.contributor.author | Lorusso, Gian | |
dc.date.accessioned | 2024-03-25T10:02:49Z | |
dc.date.available | 2024-02-27T17:42:52Z | |
dc.date.available | 2024-03-25T10:02:49Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 1932-5150 | |
dc.identifier.other | WOS:001134890300025 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43596.2 | |
dc.source | WOS | |
dc.title | Applications of large field of view e-beam metrology to contour-based optical proximity correction modeling | |
dc.type | Journal article | |
dc.contributor.imecauthor | Das, Sayantan | |
dc.contributor.imecauthor | Gillijns, Werner | |
dc.contributor.imecauthor | Halder, Sandip | |
dc.contributor.imecauthor | Lorusso, Gian | |
dc.contributor.orcidimec | Das, Sayantan::0000-0002-3031-0726 | |
dc.contributor.orcidimec | Gillijns, Werner::0000-0002-2430-7360 | |
dc.contributor.orcidimec | Halder, Sandip::0000-0002-6314-2685 | |
dc.contributor.orcidimec | Lorusso, Gian::0000-0003-3498-5082 | |
dc.identifier.doi | 10.1117/1.JMM.22.4.041603 | |
dc.source.numberofpages | 19 | |
dc.source.peerreview | yes | |
dc.source.beginpage | Art. 041603 | |
dc.source.endpage | N/A | |
dc.source.journal | JOURNAL OF MICRO-NANOPATTERNING MATERIALS AND METROLOGY-JM3 | |
dc.source.issue | 4 | |
dc.source.volume | 22 | |
imec.availability | Published - imec | |
dc.description.wosFundingText | The authors would like to thank Andrew Burbine, Sophie Jin, and Gabriel Curvacho for the fruitful discussions, Ana-Maria Armeanu for the discussions of stochastic modeling, Stewart Wu for tool development, and Rajiv Sejpal for supporting the wafer data collection. The authors would also like to thank the IMEC, Siemens EDA, and TASMIT co-workers who were involved in this project. This project received funding from the ECSEL Joint Undertaking (JU) (Grant No. 783247). The JU receives support from the European Union's Horizon 2019 research and innovation program and Netherlands, Belgium, Germany, France, Austria, United Kingdom, Israel, and Switzerland. | |