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Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform

dc.contributor.authorKarve, Gauri
dc.contributor.authorLi, Yunlong
dc.contributor.authorMotsnyi, Vasyl
dc.contributor.authorWei, Wei
dc.contributor.authorVisker, Jakob
dc.contributor.authorChancerel, Francois
dc.contributor.authorAckaert, Jan
dc.contributor.authorPuybaret, Renaud
dc.contributor.authorDutta, Barundeb
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorPeng, Lan
dc.contributor.authorSoussan, Philippe
dc.contributor.authorSeveri, Simone
dc.contributor.authorOsman, Haris
dc.date.accessioned2024-09-19T09:56:43Z
dc.date.available2024-04-14T16:53:34Z
dc.date.available2024-09-19T09:56:43Z
dc.date.issued2024
dc.identifier.issn0021-4922
dc.identifier.otherWOS:001198323000001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43825.2
dc.sourceWOS
dc.titleWafer reconstitution: embedded multi-die III-V and silicon co-integration platform
dc.typeJournal article
dc.contributor.imecauthorKarve, Gauri
dc.contributor.imecauthorMotsnyi, Vasyl
dc.contributor.imecauthorWei, Wei
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorChancerel, Francois
dc.contributor.imecauthorAckaert, Jan
dc.contributor.imecauthorPuybaret, Renaud
dc.contributor.imecauthorDutta, Barundeb
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorSeveri, Simone
dc.contributor.imecauthorOsman, Haris
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.orcidimecKarve, Gauri::0009-0002-7316-5917
dc.contributor.orcidimecMotsnyi, Vasyl::0000-0001-5297-9298
dc.contributor.orcidimecWei, Wei::0000-0002-1635-0924
dc.contributor.orcidimecChancerel, Francois::0000-0003-4512-1634
dc.contributor.orcidimecPuybaret, Renaud::0000-0002-4946-2658
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecSeveri, Simone::0009-0005-8734-5646
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.identifier.doi10.35848/1347-4065/ad32e2
dc.source.numberofpages6
dc.source.peerreviewyes
dc.source.beginpageArt. 04SP42
dc.source.endpageN/A
dc.source.journalJAPANESE JOURNAL OF APPLIED PHYSICS
dc.source.issue4
dc.source.volume63
imec.availabilityPublished - imec
dc.description.wosFundingTextThe authors would like to thank DISCO USA for the collaboration on collective grinding, Prof. Tom van der Donck for his assistance in elemental analysis, and III-V labs at imec for the sample processing.


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220.500.12860/43825.2*2024-09-19T09:53:48Zvalidation by library/open access desk
120.500.12860/438252024-04-14T16:53:34Z

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