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Integration of HSQ in the direct-on-metal approach for 0.25-μm technology

dc.contributor.authorGao, Teng
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorBruynseraede, Christophe
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T12:59:04Z
dc.date.available2021-10-14T12:59:04Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4382
dc.sourceIIOimport
dc.titleIntegration of HSQ in the direct-on-metal approach for 0.25-μm technology
dc.typeJournal article
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage349
dc.source.endpage355
dc.source.journalMicroelectronic Engineering
dc.source.issue1_4
dc.source.volume50
imec.availabilityPublished - imec


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