dc.contributor.author | Chen, Cheng | |
dc.contributor.author | Gao, Boyuan | |
dc.contributor.author | Xue, Jiaxuan | |
dc.contributor.author | Li, Zhihao | |
dc.contributor.author | Wang, Jixin | |
dc.contributor.author | Dai, Yang | |
dc.contributor.author | Zhang, Zhiyong | |
dc.contributor.author | Zhao, Wu | |
dc.contributor.author | Stiens, Johan | |
dc.date.accessioned | 2025-04-30T09:18:19Z | |
dc.date.available | 2024-11-04T16:52:48Z | |
dc.date.available | 2025-04-30T09:18:19Z | |
dc.date.issued | 2024 | |
dc.identifier.issn | 0925-9635 | |
dc.identifier.other | WOS:001344162300001 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44737.2 | |
dc.source | WOS | |
dc.title | Mutant amplitude modulation behavior of MIS-like structure of few-layer graphene/SiO2/p-Si in 500-750 GHz band | |
dc.type | Journal article | |
dc.contributor.imecauthor | Stiens, Johan | |
dc.contributor.orcidimec | Stiens, Johan::0000-0001-5049-7885 | |
dc.identifier.doi | 10.1016/j.diamond.2024.111684 | |
dc.source.numberofpages | 11 | |
dc.source.peerreview | yes | |
dc.source.beginpage | Art. 111684 | |
dc.source.endpage | N/A | |
dc.source.journal | DIAMOND AND RELATED MATERIALS | |
dc.source.issue | December | |
dc.source.volume | 150 | |
imec.availability | Published - imec | |
dc.description.wosFundingText | The authors of Vrije Universiteit Brussel (VUB) and Interuniversity Microelectronic Center (IMEC) acknowledge the funding by the SRP-project M3D2; the ETRO-IOF242 project; acknowledge the OZR-3251 project ("GHz-THz VNA measurement infrastructure: from benchtop to portable instruments") , which provides a strong economic guarantee for the establishment of the THz-VNA platform. The authors of Northwest University (NWU) acknowledge the funding of Youth Project of Shaanxi Natural Science Foundation (2023-JC-QN-0700) ; Visiting Scholar from China Scholarship Council (202306970038) ; Postdoctoral Research Project of Shaanxi Province of Cheng Chen. Also, acknowledge for the support of Xi'an New Low-dimensional Materials and Devices and Terahertz Technology International Science and Technology Cooperation Base. | |