Show simple item record

Flip-Chip Montage statt Draht-Bonden

dc.contributor.authorLabie, Riet
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorHonoré, Mia
dc.contributor.authorBeerten, Steven
dc.date.accessioned2021-10-14T13:12:04Z
dc.date.available2021-10-14T13:12:04Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4499
dc.sourceIIOimport
dc.titleFlip-Chip Montage statt Draht-Bonden
dc.typeJournal article
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1141
dc.source.endpage1143
dc.source.journalProduktion von Leiterplatten und Systemen
dc.source.issue7
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
4493.pdf
Size:
416.2Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record