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Self-annealing characterization of electroplated copper films

dc.contributor.authorLagrange, Sébastien
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorJudelewicz, Moshe
dc.contributor.authorSaerens, Annelies
dc.contributor.authorVervoort, Iwan
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorPalmans, Roger
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T13:13:03Z
dc.date.available2021-10-14T13:13:03Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4507
dc.sourceIIOimport
dc.titleSelf-annealing characterization of electroplated copper films
dc.typeJournal article
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage449
dc.source.endpage457
dc.source.journalMicroelectronic Engineering
dc.source.issue1_4
dc.source.volume50
imec.availabilityPublished - open access


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