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dc.contributor.authorLoo, Roger
dc.contributor.authorAkula, Anjani
dc.contributor.authorShimura, Yosuke
dc.contributor.authorPorret, Clément
dc.contributor.authorRosseel, Erik
dc.contributor.authorDursap, Thomas
dc.contributor.authorHikavyy, Andriy
dc.contributor.authorBeggiato, Matteo
dc.contributor.authorBogdanowicz, Janusz
dc.contributor.authorMerkulov, Alex
dc.contributor.authorAyyad, Mustafa
dc.contributor.authorHan, Han
dc.contributor.authorRichard, Olivier
dc.contributor.authorImpagnatiello, Andrea
dc.contributor.authorWang, D.
dc.contributor.authorYamamoto, K.
dc.contributor.authorSipocz, T.
dc.contributor.authorKerekes, A.
dc.contributor.authorMertens, Hans
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorLanger, Robert
dc.date.accessioned2025-03-06T11:34:43Z
dc.date.available2025-01-26T18:35:32Z
dc.date.available2025-03-06T11:34:43Z
dc.date.issued2025
dc.identifier.issn2162-8769
dc.identifier.otherWOS:001400636100001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45116.2
dc.sourceWOS
dc.titleEpitaxial Si/SiGe Multi-Stacks: From Stacked Nano-Sheet to Fork-Sheet and CFET Devices
dc.typeJournal article
dc.contributor.imecauthorLoo, Roger
dc.contributor.imecauthorAkula, Anjani
dc.contributor.imecauthorShimura, Yosuke
dc.contributor.imecauthorPorret, Clément
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorDursap, Thomas
dc.contributor.imecauthorHikavyy, Andriy
dc.contributor.imecauthorBeggiato, Matteo
dc.contributor.imecauthorBogdanowicz, Janusz
dc.contributor.imecauthorMerkulov, Alex
dc.contributor.imecauthorAyyad, Mustafa
dc.contributor.imecauthorHan, Han
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorImpagnatiello, Andrea
dc.contributor.imecauthorMertens, Hans
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorLanger, Robert
dc.contributor.orcidimecLoo, Roger::0000-0003-3513-6058
dc.contributor.orcidimecAkula, Anjani::0009-0002-8111-1513
dc.contributor.orcidimecShimura, Yosuke::0000-0002-1944-9970
dc.contributor.orcidimecPorret, Clément::0000-0002-4561-348X
dc.contributor.orcidimecRosseel, Erik::0000-0002-2737-8391
dc.contributor.orcidimecHikavyy, Andriy::0000-0002-8201-075X
dc.contributor.orcidimecBeggiato, Matteo::0000-0003-0873-9021
dc.contributor.orcidimecBogdanowicz, Janusz::0000-0002-7503-8922
dc.contributor.orcidimecMerkulov, Alex::0000-0003-4101-0873
dc.contributor.orcidimecAyyad, Mustafa::0000-0003-2222-8295
dc.contributor.orcidimecHan, Han::0000-0003-2169-8332
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecImpagnatiello, Andrea::0000-0002-0923-4642
dc.contributor.orcidimecDursap, Thomas::0009-0004-8907-4969
dc.contributor.orcidimecMertens, Hans::0000-0002-3392-6892
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecLanger, Robert::0000-0002-1132-3468
dc.date.embargo2025-01-20
dc.identifier.doi10.1149/2162-8777/ada79f
dc.source.numberofpages8
dc.source.peerreviewyes
dc.source.beginpageArt. 015003
dc.source.endpageN/A
dc.source.journalECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
dc.source.issue1
dc.source.volume14
imec.availabilityPublished - open access
dc.description.wosFundingTextThis project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 101007254. The JU receives support from the European Union's Horizon 2020 research and innovation programme and Netherlands, Germany, France, Czech Republic, Austria, Spain, Belgium, Israel. The project is also supported by the Chips Joint Undertaking and its members, including the top-up funding by VLAIO. Parts of the results were achieved using the NanoIC pilot line, which is supported by the Flemish government (Belgium) and received funding from the Chips Joint Undertaking through the Horizon Europe program under grant agreement No 101183277." As set out in the Grant Agreement, beneficiaries must ensure that at the latest at the time of publication, open access is provided via a trusted repository to the published version or the final peer-reviewed manuscript accepted for publication under the latest available version of the Creative Commons Attribution International Public Licence (CC BY). For the purpose of open access the author has applied a CC BY public copyright licence to any Author Accepted Manuscript version arising from this submission.


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