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New plating bath for electroless copper deposition on sputtered barrier layers

dc.contributor.authorLantasov, Yuri
dc.contributor.authorPalmans, Roger
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T13:14:18Z
dc.date.available2021-10-14T13:14:18Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4517
dc.sourceIIOimport
dc.titleNew plating bath for electroless copper deposition on sputtered barrier layers
dc.typeJournal article
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage441
dc.source.endpage447
dc.source.journalMicroelectronic Engineering
dc.source.issue1_4
dc.source.volume50
imec.availabilityPublished - open access
imec.internalnotesPaper from MAM 1999


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