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Thermo-mechanical modelling enhances optimisation of IC packages

dc.contributor.authorMarent, Katrien
dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-14T13:20:32Z
dc.date.available2021-10-14T13:20:32Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4565
dc.sourceIIOimport
dc.titleThermo-mechanical modelling enhances optimisation of IC packages
dc.typeJournal article
dc.contributor.imecauthorMarent, Katrien
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.beginpage69
dc.source.endpage72
dc.source.journalTAPtechnology
dc.source.issueJuly
imec.availabilityPublished - imec


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