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Electromigration-induced drift in damascene and plasma-etched Al(Cu). I: Kinetics of Cu depletion in polycrystalline interconnects

dc.contributor.authorProost, Joris
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorMaex, Karen
dc.contributor.authorD'Haen, Jan
dc.contributor.authorCosemans, P.
dc.date.accessioned2021-10-14T13:37:14Z
dc.date.available2021-10-14T13:37:14Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4681
dc.sourceIIOimport
dc.titleElectromigration-induced drift in damascene and plasma-etched Al(Cu). I: Kinetics of Cu depletion in polycrystalline interconnects
dc.typeJournal article
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorD'Haen, Jan
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage86
dc.source.endpage98
dc.source.journalJournal of Applied Physics
dc.source.issue1
dc.source.volume87
imec.availabilityPublished - open access


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