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Zero-level packaging for MEMS or MST devices: the IRS method

dc.contributor.authorTilmans, Harrie
dc.contributor.authorVan De Peer, Myriam
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T13:54:39Z
dc.date.available2021-10-14T13:54:39Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4795
dc.sourceIIOimport
dc.titleZero-level packaging for MEMS or MST devices: the IRS method
dc.typeJournal article
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorVan De Peer, Myriam
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage37
dc.source.endpage39
dc.source.journalAdvancing Microelectronics
dc.source.issue6
dc.source.volume27
imec.availabilityPublished - imec


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