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Chip-package co-design of a 4.7 GHz VCO

dc.contributor.authorVaesen, Kristof
dc.contributor.authorDonnay, Stephane
dc.contributor.authorPieters, Philip
dc.contributor.authorCarchon, Geert
dc.contributor.authorDiels, Wim
dc.contributor.authorWambaq, P.
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.authorEngels, Marc
dc.contributor.authorBolsens, Ivo
dc.date.accessioned2021-10-14T13:55:34Z
dc.date.available2021-10-14T13:55:34Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4800
dc.sourceIIOimport
dc.titleChip-package co-design of a 4.7 GHz VCO
dc.typeJournal article
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorDonnay, Stephane
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecDonnay, Stephane::0000-0003-2489-4793
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage272
dc.source.endpage279
dc.source.journalIMAPS International Journal of Microcircuits and Electronic Packaging
dc.source.issue3
dc.source.volume23
imec.availabilityPublished - open access


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