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Improved thermal fatigue reliability for flip chip assemblies using redistribution techniques

dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T14:09:14Z
dc.date.available2021-10-14T14:09:14Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4884
dc.sourceIIOimport
dc.titleImproved thermal fatigue reliability for flip chip assemblies using redistribution techniques
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage239
dc.source.endpage246
dc.source.journalIEEE Trans. Advanced Packaging
dc.source.issue2
dc.source.volume23
imec.availabilityPublished - open access


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