Browsing Articles by imec author "6ba854a03ba43a99603f3feaa0360d0b4898806f"
Now showing items 1-2 of 2
-
A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stacking
Hou, Lin; Derakhshandeh, Jaber; Capuz, Giovanni; Beyne, Eric; De Wolf, Ingrid (2020) -
Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision
Marinins, Aleksandrs; Hansch, Sebastian; Sar, Huseyin; Chancerel, Francois; Golshani, Negin; Wang, Hsiao-Lun; Tsiara, Artemisia; Coenen, David; Verheyen, Peter; Capuz, Giovanni; De Koninck, Yannick; Yilmaz, Ozan; Morthier, Geert; Schleicher, Filip; Jamieson, Geraldine; Smyth, Stuart; McKee, Andrew; Ban, Yoojin; Pantouvaki, Marianna; La Tulipe, Douglas Charles; Van Campenhout, Joris (2023)