Authors

Hou, Lin; Derakhshandeh, Jaber; Capuz, Giovanni; Beyne, Eric; De Wolf, Ingrid

ISSN

2156-3950

Issue

4

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volume

10

Title

A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stacking

Publication type

Journal article

Embargo date

9999-12-31