Publication:

A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stacking

Date

2020
Journal article
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42948.pdf 4.04 MB

Author(s)

Hou, Lin  
;
Derakhshandeh, Jaber  
;
Capuz, Giovanni  
;
Beyne, Eric  
;
De Wolf, Ingrid  

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Abstract

Description

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1977 since deposited on 2021-10-28
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1 since deposited on 2021-10-28
Acq. date: 2026-10-04

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1977 since deposited on 2021-10-28
Acq. date: 2026-10-04

Citations