Publication:

A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stacking

Date

2020
Journal article
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dc.contributor.authorHou, Lin
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-28T22:37:56Z
dc.date.available2021-10-28T22:37:56Z
dc.date.embargo9999-12-31
dc.date.issued2020
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35284
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8974431
dc.source.beginpage669
dc.source.endpage678
dc.source.issue4
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.volume10
dc.title

A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stacking

dc.typeJournal article
dspace.entity.typePublication
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