Browsing Articles by imec author "f7c060856060171ab0565fd41170658e4ab08723"
Now showing items 1-6 of 6
-
Characterisation and integration feasibility of JSR's low-k dielectric LKD-5109
Das, Arabinda; Kokubo, Terukazu; Furukawa, Yukiko; Struyf, Herbert; Vos, Ingrid; Sijmus, Bram; Iacopi, Francesca; Van Aelst, Joke; Le, Quoc Toan; Carbonell, Laure; Brongersma, Sywert; Maenhoudt, Mireille; Tokei, Zsolt; Vervoort, Iwan; Sleeckx, Erik; Stucchi, Michele; Schaekers, Marc; Boullart, Werner; Rosseel, Erik; Van Hove, Marleen; Vanhaelemeersch, Serge; Shiota, A.; Maex, Karen (2002) -
High aspect ratio via etch development for Cu nails in 3-D-stacked ICs
Van Aelst, Joke; Struyf, Herbert; Boullart, Werner; Vanhaelemeersch, Serge (2008) -
Influence of absorbed water components on SiOCH low-k reliability
Li, Yunlong; Ciofi, Ivan; Carbonell, Laure; Heylen, Nancy; Van Aelst, Joke; Baklanov, Mikhaïl; Groeseneken, Guido; Maex, Karen; Tokei, Zsolt (2008-08) -
Plasma ash modulation of TDDB thermal activation energy in damascene SiOC:H
Li, Yunlong; Tokei, Zsolt; Van Aelst, Joke; Carbonell, Laure; Baklanov, Mikhaïl; Richard, Olivier; Bender, Hugo; Groeseneken, Guido; Maex, Karen (2007) -
Single damascene integration of porous zirkonTM version 1 low-k dielectric films
Malhouitre, Stéphane; Jehoul, Christiane; Van Aelst, Joke; Struyf, Herbert; Brongersma, Sywert; Carbonell, Laure; Vos, Ingrid; Beyer, Gerald; Van Hove, Marleen; Gronbeck, D.; Gallagher, M.; Calvert, J.; Maex, Karen (2003-11) -
Wafer bevel protection during deep reactive ion etching
Charavel, Remy; Roig, Jaime; Altamirano Sanchez, Efrain; Van Aelst, Joke; Devriendt, Katia; Van Wichelen, Koen; Gassot, Pierre; Coppens, Peter; De Backer, Eddy (2011)