Browsing Articles by imec author "16ae8db2f870dcb03f423a4e5c30e3509c6aa3c8"
Now showing items 21-28 of 28
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Structural characterization of through silicon vias (TSV)
Bender, Hugo; Drijbooms, Chris; Van Marcke, Patricia; Geypen, Jef; Philipsen, Harold; Radisic, Alex (2012) -
The effect of cupric ion concentration on the nucleation and growth of copper on RuTa seeded substrates
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2013) -
The effect of polyether suppressors on the nucleation and growth of copper on RuTa seeded substrate for direct copper plating
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2014) -
The effect of the substrate characteristics on the electrochemical nucleation and growth of copper
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2016) -
The limitation and optimization of bottom-up growth mode in through silicon via electroplating
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2015) -
Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed
Armini, Silvia; El-Mekki, Zaid; Vandersmissen, Kevin; Philipsen, Harold; Rodet, Simon; Honore, Mia; Radisic, Alex; Civale, Yann; Beyne, Eric; Leunissen, Peter (2011) -
Wafer scale copper direct plating on thin PVD RuTa layers: A route to enable filling 30 nm features and below?
Armini, Silvia; El-Mekki, Zaid; Nagar, Margalit; Radisic, Alex; Vereecken, Philippe (2014) -
Wafer-scale Cu plating uniformity on thin Cu seed layers
Yang, Liu; Atanasova, Tanya; Radisic, Alex; Deconinck, Johan; West, Alan; Vereecken, Philippe (2013)