Wafer-scale Cu plating uniformity on thin Cu seed layers

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Authors
Yang, Liu; Atanasova, Tanya; Radisic, Alex; Deconinck, Johan; West, Alan; Vereecken, Philippe
ISSN
0013-4686
Journal
Electrochimica Acta
Volume
104
Title
Wafer-scale Cu plating uniformity on thin Cu seed layers
Publication type
Journal article
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