Publication:

Wafer-scale Cu plating uniformity on thin Cu seed layers

Date

2013
Journal article
Simple item page Full metadata Statistics
 
dc.contributor.authorYang, Liu
dc.contributor.authorAtanasova, Tanya
dc.contributor.authorRadisic, Alex
dc.contributor.authorDeconinck, Johan
dc.contributor.authorWest, Alan
dc.contributor.authorVereecken, Philippe
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.accessioned2021-10-21T14:49:58Z
dc.date.available2021-10-21T14:49:58Z
dc.date.issued2013
dc.identifier.issn0013-4686
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23417
dc.identifier.urlhttp://dx.doi.org/10.1016/j.electacta.2013.04.094
dc.source.beginpage242
dc.source.endpage248
dc.source.journalElectrochimica Acta
dc.source.volume104
dc.title

Wafer-scale Cu plating uniformity on thin Cu seed layers

dc.typeJournal article
dspace.entity.typePublication
Files
Publication available in collections:
Articles