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Multilayer thin-film MCM-D for the integration of high- performance RF and microwave circuits

dc.contributor.authorCarchon, Geert
dc.contributor.authorVaesen, Kristof
dc.contributor.authorBrebels, Steven
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.authorNauwelaers, Bart
dc.date.accessioned2021-10-14T16:40:17Z
dc.date.available2021-10-14T16:40:17Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5119
dc.sourceIIOimport
dc.titleMultilayer thin-film MCM-D for the integration of high- performance RF and microwave circuits
dc.typeJournal article
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage510
dc.source.endpage519
dc.source.journalIEEE Trans. Components and Packaging Technologies
dc.source.issue3
dc.source.volume24
imec.availabilityPublished - imec


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