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The vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructures

dc.contributor.authorDessein, Kristof
dc.contributor.authorKumar, P. S. A.
dc.contributor.authorNemeth, Stefan
dc.contributor.authorDelaey, L.
dc.contributor.authorBorghs, Gustaaf
dc.contributor.authorDe Boeck, Jo
dc.date.accessioned2021-10-14T16:50:36Z
dc.date.available2021-10-14T16:50:36Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5244
dc.sourceIIOimport
dc.titleThe vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructures
dc.typeJournal article
dc.contributor.imecauthorNemeth, Stefan
dc.contributor.imecauthorBorghs, Gustaaf
dc.contributor.imecauthorDe Boeck, Jo
dc.source.peerreviewno
dc.source.beginpage906
dc.source.endpage910
dc.source.journalJournal of Crystal Growth
dc.source.volume227
imec.availabilityPublished - imec


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