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dc.contributor.authorDombrowski, Kai
dc.contributor.authorDietrich, B.
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorRooyackers, Rita
dc.contributor.authorBadenes, Gonçal
dc.date.accessioned2021-10-14T16:52:15Z
dc.date.available2021-10-14T16:52:15Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5260
dc.sourceIIOimport
dc.titleInvestigation of stress in shallow trench isolation using UV micro-raman spectroscopy
dc.typeJournal article
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage511
dc.source.endpage515
dc.source.journalMicroelectronics Reliability
dc.source.issue4
dc.source.volume41
imec.availabilityPublished - imec


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