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dc.contributor.authorDriessens, Evelien
dc.contributor.authorVan Dooren, Sofie
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDegryse, Dominiek
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T16:53:24Z
dc.date.available2021-10-14T16:53:24Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5270
dc.sourceIIOimport
dc.titleTransient thermal characterization of the polymer stud grid array(tm)
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage554
dc.source.endpage558
dc.source.journalIEEE Trans. Components and Packaging Technologies
dc.source.issue4
dc.source.volume24
imec.availabilityPublished - imec


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