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Modeling differential via holes

dc.contributor.authorLaermans, Eric
dc.contributor.authorDe Geest, Jan
dc.contributor.authorDe Zutter, Daniel
dc.contributor.authorOlyslager, Frank
dc.contributor.authorSercu, Stefaan
dc.contributor.authorMorlion, D.
dc.date.accessioned2021-10-14T17:11:42Z
dc.date.available2021-10-14T17:11:42Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5416
dc.sourceIIOimport
dc.titleModeling differential via holes
dc.typeJournal article
dc.contributor.imecauthorLaermans, Eric
dc.contributor.imecauthorDe Zutter, Daniel
dc.contributor.orcidimecLaermans, Eric::0000-0002-1811-9419
dc.source.peerreviewno
dc.source.beginpage357
dc.source.endpage363
dc.source.journalIEEE Trans. Advanced Packaging
dc.source.issue3
dc.source.volume24
imec.availabilityPublished - imec


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