Browsing Presentations by imec author "2d6906d82164974a2c090805ab4196dda05e4dfa"
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Edge shape control for bonded wafer
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric (2017) -
New approach to apply 1,2,3-benzotriazole as a capping layer on UBMs for 3D TCB stacking and investigation of oxidation protection and solder wetting
Derakhshandeh, Jaber; Shehzad, Adil; Wunderle, Benhard; Hou, Lin; Suhard, Samuel; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Using wafer leve underfill for 3D packaging
Rebibis, Kenneth June; Gerets, Carine; Beyne, Eric; La Manna, Antonio (2011)