Browsing Presentations by author "Okoro, Chukwudi"
Now showing items 1-2 of 2
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Evaluation of photosensitive spin-on-dielectrics for 3-D wafer level packaging
Duval, Fabrice; Soussan, Philippe; Miller, Andy; De Raedt, Walter; Sun, Xiao; Beyne, Eric; Okoro, Chukwudi (2010) -
Thermal and mechanical aspects for flexible embedded components
Vandevelde, Bart; Brebels, Steven; Okoro, Chukwudi; Oprins, Herman; Chen, L.C. (2007)