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Using atomic layer deposition to prepare future-generation copper diffusion barriers

dc.contributor.authorBeyer, Gerald
dc.contributor.authorVan Bavel, Mieke
dc.date.accessioned2021-10-14T21:08:50Z
dc.date.available2021-10-14T21:08:50Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6010
dc.sourceIIOimport
dc.titleUsing atomic layer deposition to prepare future-generation copper diffusion barriers
dc.typeJournal article
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorVan Bavel, Mieke
dc.source.peerreviewno
dc.source.beginpage51
dc.source.endpage58
dc.source.journalMicro
dc.source.issue9
dc.source.volume20
imec.availabilityPublished - imec


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