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High bandwidth interconnects via a novel chip-stack package

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T21:08:52Z
dc.date.available2021-10-14T21:08:52Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6011
dc.sourceIIOimport
dc.titleHigh bandwidth interconnects via a novel chip-stack package
dc.typeJournal article
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpageS19
dc.source.endpageS22
dc.source.journalSolid State Technology
dc.source.issue4
dc.source.volume45
imec.availabilityPublished - open access


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