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Grain growth, stress, and impurities in electroplated copper

dc.contributor.authorBrongersma, Sywert
dc.contributor.authorKerr, Emma
dc.contributor.authorVervoort, Iwan
dc.contributor.authorSaerens, Annelies
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T21:11:45Z
dc.date.available2021-10-14T21:11:45Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6069
dc.sourceIIOimport
dc.titleGrain growth, stress, and impurities in electroplated copper
dc.typeJournal article
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.beginpage582
dc.source.endpage589
dc.source.journalJournal of Materials Research
dc.source.issue3
dc.source.volume17
imec.availabilityPublished - imec


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