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Half-conductive coupling interconnection technology for digital transmission between CMOS chips

dc.contributor.authorDevisch, Frédéric
dc.contributor.authorMaillard, X.
dc.contributor.authorPan, Wanling
dc.contributor.authorDe Tandt, Cathleen
dc.contributor.authorVounckx, Roger
dc.contributor.authorKuijk, Maarten
dc.date.accessioned2021-10-14T21:31:49Z
dc.date.available2021-10-14T21:31:49Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6280
dc.sourceIIOimport
dc.titleHalf-conductive coupling interconnection technology for digital transmission between CMOS chips
dc.typeJournal article
dc.contributor.imecauthorVounckx, Roger
dc.source.peerreviewno
dc.source.beginpage92
dc.source.endpage97
dc.source.journalIEEE Trans. Advanced Packaging
dc.source.issue1
dc.source.volume25
imec.availabilityPublished - imec


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