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Factors affecting an efficient sealing of porous low-K dielectrics by physical vapor deposition Ta(N) thin films

dc.contributor.authorIacopi, Francesca
dc.contributor.authorTokei, Zsolt
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorShamiryan, Denis
dc.contributor.authorConard, Thierry
dc.contributor.authorBrijs, Bert
dc.contributor.authorKreissig, U.
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T21:52:05Z
dc.date.available2021-10-14T21:52:05Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6419
dc.sourceIIOimport
dc.titleFactors affecting an efficient sealing of porous low-K dielectrics by physical vapor deposition Ta(N) thin films
dc.typeJournal article
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.source.peerreviewno
dc.source.beginpage1548
dc.source.endpage1554
dc.source.journalJournal of Applied Physics
dc.source.issue3
dc.source.volume92
imec.availabilityPublished - imec


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