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Modelling complex via hole structures

dc.contributor.authorLaermans, E.
dc.contributor.authorDe Geest, J.
dc.contributor.authorDe Zutter, Daniel
dc.contributor.authorOlyslager, Frank
dc.contributor.authorSercu, S.
dc.contributor.authorMorlion, D.
dc.date.accessioned2021-10-14T22:06:12Z
dc.date.available2021-10-14T22:06:12Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6503
dc.sourceIIOimport
dc.titleModelling complex via hole structures
dc.typeJournal article
dc.contributor.imecauthorDe Zutter, Daniel
dc.source.peerreviewno
dc.source.beginpage206
dc.source.endpage214
dc.source.journalIEEE Trans. Advanced Packaging
dc.source.issue2
dc.source.volume25
imec.availabilityPublished - imec


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