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Inductance extraction for package with adaptive non-orthogonal ground plane meshing

dc.contributor.authorLippens, G.
dc.contributor.authorDe Zutter, Daniel
dc.date.accessioned2021-10-14T22:12:57Z
dc.date.available2021-10-14T22:12:57Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6542
dc.sourceIIOimport
dc.titleInductance extraction for package with adaptive non-orthogonal ground plane meshing
dc.typeJournal article
dc.contributor.imecauthorDe Zutter, Daniel
dc.source.peerreviewno
dc.source.beginpage223
dc.source.endpage229
dc.source.journalIEEE Trans. Advanced Packaging
dc.source.issue2
dc.source.volume25
imec.availabilityPublished - imec


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