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Zero-level packaging for MEMS

dc.contributor.authorRusu, Cristina
dc.contributor.authorJourdain, Anne
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-14T22:59:53Z
dc.date.available2021-10-14T22:59:53Z
dc.date.issued2002-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6779
dc.sourceIIOimport
dc.titleZero-level packaging for MEMS
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.conferenceThe GOOD-DIE International Workshop CAST - Challenges for Advanced Semiconductor-die Technologies
dc.source.conferencedate22/05/2002
dc.source.conferencelocationBrugge Belgium
imec.availabilityPublished - imec
imec.internalnotescopy slides only


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