Electrochemical copper deposition in IC manufacturing
| dc.contributor.author | Teerlinck, Ivo | |
| dc.date.accessioned | 2021-10-14T23:20:16Z | |
| dc.date.available | 2021-10-14T23:20:16Z | |
| dc.date.issued | 2002-06 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6873 | |
| dc.source | IIOimport | |
| dc.title | Electrochemical copper deposition in IC manufacturing | |
| dc.type | PHD thesis | |
| dc.date.embargo | 9999-12-31 | |
| dc.source.peerreview | no | |
| dc.contributor.thesisadvisor | Strubbe, K. | |
| dc.contributor.thesisadvisor | Heyns, Marc | |
| imec.availability | Published - open access |