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Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies

dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandepitte, D.
dc.contributor.authorBaelmans, M.
dc.date.accessioned2021-10-14T23:46:39Z
dc.date.available2021-10-14T23:46:39Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6991
dc.sourceIIOimport
dc.titleSemi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage264
dc.source.endpage278
dc.source.journalInternational Journal of Microcircuits and Electronic Packaging
dc.source.issue3
dc.source.volume25
imec.availabilityPublished - imec


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