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Solder parameter sensitivity for CSP life-time prediction using simulation-based optimisation method

dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorZhang, K.G.Q.
dc.contributor.authorCaers, J.F.J.M.
dc.contributor.authorVandepitte, D.
dc.contributor.authorBaelmans, Martine
dc.date.accessioned2021-10-14T23:46:53Z
dc.date.available2021-10-14T23:46:53Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6992
dc.sourceIIOimport
dc.titleSolder parameter sensitivity for CSP life-time prediction using simulation-based optimisation method
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage318
dc.source.endpage325
dc.source.journalIEEE Trans. Electronics Packaging Manufacturing
dc.source.issue4
dc.source.volume25
imec.availabilityPublished - imec


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