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Multilayer thin-film technology, enabling technology for solving high-density interconnect and assembly problems

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T04:01:14Z
dc.date.available2021-10-15T04:01:14Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7208
dc.sourceIIOimport
dc.titleMultilayer thin-film technology, enabling technology for solving high-density interconnect and assembly problems
dc.typeJournal article
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage191
dc.source.endpage199
dc.source.journalNuclear Instruments & Methods in Physics Research A
dc.source.volume509
imec.availabilityPublished - imec
imec.internalnotesPaper from the 4th Int. Workshop on Radiation Imaging Detectors; Sept. 2002; Amsterdam


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