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Copper deposition and subsequent grain structure evolution in narrow lines

dc.contributor.authorBrongersma, Sywert
dc.contributor.authorD'Haen, Jan
dc.contributor.authorVanstreels, Kris
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorVervoort, Iwan
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T04:04:26Z
dc.date.available2021-10-15T04:04:26Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7261
dc.sourceIIOimport
dc.titleCopper deposition and subsequent grain structure evolution in narrow lines
dc.typeJournal article
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorD'Haen, Jan
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage2485
dc.source.endpage2490
dc.source.journalMaterials Science Forum
dc.source.issue1_5
dc.source.volume426-4
imec.availabilityPublished - open access
imec.internalnotesThermec'2003


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