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Study of damage and stress induced by backgrinding in Si wafers

dc.contributor.authorChen, Jian
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-15T04:08:21Z
dc.date.available2021-10-15T04:08:21Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7310
dc.sourceIIOimport
dc.titleStudy of damage and stress induced by backgrinding in Si wafers
dc.typeJournal article
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage261
dc.source.endpage268
dc.source.journalSemiconductor Science and Technology
dc.source.issue4
dc.source.volume18
imec.availabilityPublished - imec


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